| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| PIC24FJ64GA002T-I/SS | MICROCHIP/微芯 | SSOP28 | 21+ | 2100 | 2026-05-22 | |||
| 25LC1024T-I/SM | MICROCHIP/微芯 | SOP8 | 20+ | 23 | 2026-05-22 | |||
| ISL9230IRZ-T | RENESAS/瑞萨 | QFN16 | 22+ | 6000 | 2026-05-22 | |||
| ADS7844NB | TI/德州仪器 | SSOP20 | 15+ | 533 | 2026-05-22 | |||
| STB9NK80Z | ST/意法 | TO-263 | 16+ | 830 | 2026-05-22 | |||
| BCP56T3G | ONSEMI/安森美 | SOT-223 | 21+ | 51000 | 2026-05-22 | |||
| CA-IS3722CHS | 川土微/CHIPANALO | SOIC-8 | 24+ | 1610 | 2026-05-22 | |||
| LMV324IPT | ST/意法 | TSSOP14 | 22+ | 20000 | 2026-05-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| LS10-13B05R3P | MORNSUN/金升阳 | DIP | 24+/25+ | 622 | 2026-05-22 | |||
| VRA2412YMD-6WR3 | MORNSUN/金升阳 | DIP | 25+ | 358 | 2026-05-22 | |||
| WRB2424S-1WR2 | MORNSUN/金升阳 | DIP | 25+ | 50 | 2026-05-22 | |||
| LDE10-20B12 | MORNSUN/金升阳 | DIP | 25+ | 270 | 2026-05-22 | |||
| B2415S-2WR3 | MORNSUN/金升阳 | DIP | 24+ | 940 | 2026-05-22 | |||
| B1212S-1WR3 | MORNSUN/金升阳 | DIP | 24+ | 502 | 2026-05-22 | |||
| K7805-1000R3 | MORNSUN/金升阳 | DIP | 25+ | 303 | 2026-05-22 | |||
| BQ24045DSQR | TI/德州仪器 | WSON10 | 2020+ | 300 | 2026-05-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| IB1205LS-1WR3 | MORNSUN/金升阳 | DIP | 25+ | 296 | 2026-05-22 | |||
| B1505S-1WR3 | MORNSUN/金升阳 | SIP | 25+ | 843 | 2026-05-22 | |||
| A1215S-1WR3 | MORNSUN/金升阳 | SIP | 24+/25+ | 303 | 2026-05-22 | |||
| A2424S-2WR3 | MORNSUN/金升阳 | DIP | 24+ | 157 | 2026-05-22 | |||
| VRB2424S-6WR3 | MORNSUN/金升阳 | DIP | 24+/25+ | 100 | 2026-05-22 | |||
| F2424S-2WR3 | MORNSUN/金升阳 | DIP | 25+ | 810 | 2026-05-22 | |||
| H2405S-1WR3 | MORNSUN/金升阳 | DIP | 25+ | 210 | 2026-05-22 | |||
| WRB2403S-3WR2 | MORNSUN/金升阳 | DIP | 24+/25+ | 298 | 2026-05-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| B0509LS-1WR3 | MORNSUN/金升阳 | DIP | 24+ | 304 | 2026-05-22 | |||
| URB4812YMD-6WR3 | MORNSUN/金升阳 | DIP | 24+ | 139 | 2026-05-22 | |||
| VRB0512ZP-6WR3 | MORNSUN/金升阳 | DIP | 25+ | 195 | 2026-05-22 | |||
| VRB2424S-10WR3 | MORNSUN/金升阳 | DIP | 24+ | 269 | 2026-05-22 | |||
| VRA2415YMD-6WR3 | MORNSUN/金升阳 | SIP | 24+ | 363 | 2026-05-22 | |||
| URB2424S-6WR3 | MORNSUN/金升阳 | DIP | 24+ | 240 | 2026-05-22 | |||
| CUWB1212YMD-6WR3 | MORNSUN/金升阳 | DIP | 24+/25+ | 589 | 2026-05-22 | |||
| URB2415S-6WR3 | MORNSUN/金升阳 | DIP | 24+ | 101 | 2026-05-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| IB0503LS-1WR3 | MORNSUN/金升阳 | DIP | 24+/25+ | 337 | 2026-05-22 | |||
| WRA0505S-3WR2 | MORNSUN/金升阳 | DIP | 24+/25+ | 201 | 2026-05-22 | |||
| WRB2412S-1WR2 | MORNSUN/金升阳 | DIP | 25+ | 311 | 2026-05-22 | |||
| IF0503S-1WR3 | MORNSUN/金升阳 | DIP | 25+ | 259 | 2026-05-22 | |||
| A0503S-1WR3 | MORNSUN/金升阳 | DIP | 23+/24+ | 212 | 2026-05-22 | |||
| IF0505XT-1WR3 | MORNSUN/金升阳 | DIP | 24+ | 486 | 2026-05-22 | |||
| F1212S-3WR2 | MORNSUN/金升阳 | DIP | 25+ | 160 | 2026-05-22 | |||
| B0503XT-1WR3 | MORNSUN/金升阳 | DIP | 25+/24+ | 347 | 2026-05-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| KNA21301-W3 | KYOCERA/京瓷 | SMD | 2006+ | 117000 | 2026-05-22 | |||
| FL2D-10-332 | MORNSUN/金升阳 | DIP | 24+/25+ | 327 | 2026-05-22 | |||
| QA01C | MORNSUN/金升阳 | DIP | 25+ | 465 | 2026-05-22 | |||
| VRB2424YMD-6WR3 | MORNSUN/金升阳 | DIP | 24+ | 107 | 2026-05-22 | |||
| QA152D | MORNSUN/金升阳 | SIP | 25+ | 360 | 2026-05-22 | |||
| TD501D485 | MORNSUN/金升阳 | DIP | 25+ | 200 | 2026-05-22 | |||
| WRB1203S-3WR2 | MORNSUN/金升阳 | DIP | 24+ | 450 | 2026-05-22 | |||
| URH2412P-6WR3 | MORNSUN/金升阳 | DIP | 24+/25+ | 337 | 2026-05-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| TD301D485H-E | MORNSUN/金升阳 | DIP | 24+ | 139 | 2026-05-22 | |||
| TD501D485H-A | MORNSUN/金升阳 | DIP | 25+ | 551 | 2026-05-22 | |||
| TD301D485H | MORNSUN/金升阳 | DIP | 25+ | 371 | 2026-05-22 | |||
| TD321D485H-A | MORNSUN/金升阳 | DIP | 25+ | 1275 | 2026-05-22 | |||
| TD301D485H-A | MORNSUN/金升阳 | DIP | 25+ | 406 | 2026-05-22 | |||
| TD501D232H | MORNSUN/金升阳 | DIP | 24+ | 303 | 2026-05-22 | |||
| TD301DCANH3 | MORNSUN/金升阳 | DIP | 24+ | 113 | 2026-05-22 | |||
| TD321D485H | MORNSUN/金升阳 | DIP | 24+/25+ | 177 | 2026-05-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| CTM8251KAT | ZLG/致远 | DIP | 21+22+ | 264 | 2026-05-22 | |||
| CTM8251KT | ZLG/致远 | DIP | 21+22+ | 1111 | 2026-05-22 | |||
| CTM1051A | ZLG/致远 | DIP | 21+22+ | 217 | 2026-05-22 | |||
| CTM1051KAT | ZLG/致远 | DIP | 21+22+ | 727 | 2026-05-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| FL2D-Z5-103 | MORNSUN/金升阳 | DIP | 25+ | 265 | 2026-05-22 | |||
| FL2D-30-222 | MORNSUN/金升阳 | DIP | 25+ | 609 | 2026-05-22 | |||
| FL2D-Z5-153 | MORNSUN/金升阳 | DIP | 23+/24+ | 182 | 2026-05-22 | |||
| FL2D-30-102 | MORNSUN/金升阳 | DIP | 24+ | 518 | 2026-05-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| LMV324IPT | ST/意法 | TSSOP14 | 22+ | 20000 | 2026-05-22 | |||
| MC33178DR2G | ONSEMI/安森美 | SOP8 | 20+ | 40 | 2026-05-22 | |||
| LMV358IPWR | TI/德州仪器 | SSOP8 | 2017+ | 30 | 2026-05-22 | |||
| LM339N | TI/德州仪器 | DIP14 | 19+ | 7 | 2026-05-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| TDH541S485H | MORNSUN/金升阳 | DIP | 25+ | 1222 | 2026-05-22 | |||
| TD541SCANH | MORNSUN/金升阳 | SMD | 25+ | 5000 | 2026-05-22 | |||
| TD541S485H | MORNSUN/金升阳 | DIP | 24+ | 114 | 2026-05-22 | |||
| TD041S485H | MORNSUN/金升阳 | DIP | 25+ | 169 | 2026-05-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| TL7700CP | TI/德州仪器 | DIP8 | 18+ | 10 | 2026-05-22 | |||
| TPS259251DRCR | TI/德州仪器 | VSON-10 | 22+ | 5970 | 2026-05-22 | |||
| STD25NF10T4 | ST/意法 | TO-252 | 21+ | 281 | 2026-05-22 | |||
| MCP6561T-E/OT | MICROCHIP/微芯 | SOT23-5 | 22+ | 12 | 2026-05-22 | |||
| SUM90P10-19L-E3 | VISHAY/威世 | TO-263 | 21+ | 160 | 2026-05-22 | |||
| MP175GS-Z | MPS/美国芯源 | SOIC-8 | 21+ | 1430 | 2026-05-22 | |||
| NCV303LSN30T1G | ONSEMI/安森美 | SOT23-5 | 21+ | 3000 | 2026-05-22 | |||
| R7F7010133AFP#AA4 | RENESAS/瑞萨 | LQFP-64 | 1549+ | 185 | 2026-05-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MCP6561T-E/OT | MICROCHIP/微芯 | SOT23-5 | 22+ | 12 | 2026-05-22 | |||
| LM397MFX/NOPB | TI/德州仪器 | SOT23-5 | 21+ | 9000 | 2026-05-22 | |||
| LM397MFX/NOPB | TI/德州仪器 | SOT23-5 | 21+ | 9000 | 2026-05-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| VPS2109 | VPS | SOT23-6 | 23+ | 5000 | 2026-05-22 | |||
| VPS2107 | VPS | ESOP8 | 23+ | 4000 | 2026-05-22 | |||
| VPC2187 | VPS | MSOP-10 | 23+ | 5000 | 2026-05-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| CA-IF4820HS | CHIPANALOG/川土微 | SOIC-8 | 24+/25+ | 5534 | 2026-05-22 | |||
| ADG849YKSZ-REEL7 | ADI/亚德诺 | SC-70-6 | 22+ | 61203 | 2026-05-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| NCV303LSN30T1G | ONSEMI/安森美 | SOT23-5 | 21+ | 3000 | 2026-05-22 | |||
| TPS259251DRCR | TI/德州仪器 | VSON-10 | 22+ | 5970 | 2026-05-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| BAT46AWFILM | ST/意法 | SOT-323 | 22+ | 3000 | 2026-05-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| TPS259251DRCT | TI/德州仪器 | VSON-10 | 22+ | 5970 | 2026-05-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| TLV70215DBVR | TI/德州仪器 | SOT23-5 | 23+ | 6000 | 2026-05-22 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MP175GS-Z | MPS/美国芯源 | SOIC-8 | 21+ | 1430 | 2026-05-22 |